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Home > Digital products PCB > Smart phone flexible printed circuit board

Smart phone flexible printed circuit board

Model:E0214040057A
Layers:4 layer
Thickness: 0.2mm + steel stiffener 0.2mm
Hole Size: 0.30mm
Width/Space: 4/4mil
Surface Treatment: ENIG( Au 2 U
  • Process
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  • Name: Smart phone flexible printed circuit board
    Part No.: E0214040057A
    Layer count: 4
    Material: Polymide 0.2mm + steel stiffener 0.2mm, 1 OZ for all layer
    Minimum tack: 4mil
    Minimum space(gap): 4mil
    Minimum hole: 0.30mm
    Surface finished: ENIG( Au 2 U")
    Panel size: 50*86mm/1up
    Characteristics: multilayer FPCB,steel stifferner,for smart mobile phone
  • cell phone, smart phone

1 Hours promptly Quote
4 Hours promptly Engineering
24 Hours for 2 layer
2-5 Days for 4-20 layer
6-10 Days for 22+ layers
7*24 Hours online customer service

Flexible PCB up to 12 layer

Rigid Circuit Boards up to 48 layer

Rigid-Flex Circuit Boards up to 36 layer

Metal core printed circuit board 1-6 W/MK

High Density(HDI)Circuit Boards(Max 4 ranks) 		Plant 1 add: Shenzhen, Guangdong, China

Plant 2 add: Zhuhai, Guangdong, China

Tel: +86-755-23724206

Email:sales@hiquality-pcb.com

Contact: Shawn Wang

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